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ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.


» Number: US2017166784A1 (A1)

» Publication Date: 17//2/15/0

» Applicant: HEDRICK JAMES L?[US]; MILLER ROBERT DENNIS?[US] (6)

» Inventor: HEDRICK JAMES L?[US]; MILLER ROBERT DENNIS?[US] (5)

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