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Development Partner for Highly Thermal-Conductive and Insulating Material with Good Formability

Due Date April 7, 2017 Author Seh-Rin Sung Request for Proposal Details

Opportunity:

Contract/Joint Development, Licensing, Material Supply

 

Timeline:

Phase 1: Proof of Concept via prototype: 6-12 months

Phase 2: Development for practical realization: 1 year after Phase 1

 

Financials:

Development budget has been secured

(Details to be negotiated)

 

Program Manager:

Kevin Tanaka

 

Solution Provider Help Desk:

Email: PHD2@ninesigma.com

Phone: +1-216-283-3901

 

Please scroll to the bottom of this page to expand the "Attachments" grey section bar to find the Response Template file

RFP Title Development Partner for Highly Thermal-Conductive and Insulating Material with Good Formability RFP Description

NineSigma, representing a major material manufacturer, seeks a joint partner to develop high thermal conductivity and electrically Insulating resin with good formability.

Background

Thermal management based on thermal-conductive resin materials has become a crucial problem with increasing the density of integrated devices such as light-emitting diodes, power semiconductors, and other electronic components. Generally, to improve the thermal conductivity of a resin material, inorganic filler materials with high thermal conductivity are added to the resin. However, since there are trade-offs among high thermal conductivity, high insulation performance, and molding/laminating formability, it is difficult to keep these advantages in composite materials. The client has developed thermally conductive electrically insulating organic materials, but has not succeeded in developing the resin materials having such target performance.

 

Currently, research and development for highly thermal-conductive and insulating materials are globally ongoing. The client has issued this open request to further accelerate its development in collaboration with potential partner.

 

 

Key Success Criteria

We welcome proposals based on traditional approach such as improving base resin structures and filler dispersion as well as developing new innovative materials.

 

Ultimate Goal

  • Thermal conductivity (in thickness direction, as composite material):
    • Minimum 12 W/mK by 2018
    • Minimum 20 W/mK by 2020
  • Withstand voltage Minimum 5 kV at 100-?m thickness
  • Molding formability: Highly formable
    • Can be formed into film shape or usable as liquid prepolymer

   Film requirements

  • Thickness: Maximum 200 ?m
  • Has flexibility
  • Preferred Molding method: Compression molding, vacuum lamination, or vacuum pressing

Details of the required technology

The anticipated technologies to meet the ultimate goal are:

  • Improvements for base resin (thermosetting resin) structure
    • Currently, the client uses epoxy resin-based materials, but will study the use of other thermosetting resin.
  • Improvements for filler shape and structure
  • Filler orientation
  • Improvements to compatibility and wetting between resin and fillers
  • New materials

Anticipated Project Phases or Project Plan

The client will review submitted proposals and possibly ask clarifying questions before selecting the most suitable candidates for collaboration. The client will select the best candidate(s) through evaluations. During the selection process, the client may execute non-disclosure agreements (NDA) with selected respondent(s), seek further information disclosure, and discuss specific development targets or potential opportunities.

The client will execute necessary agreement(s) with the selected respondent(s) and move to the advanced development phase. Specifics of any collaboration will be determined through consultation with the concerned parties.

 

 

Possible Approaches

Anticipated approaches include, but are not limited to, the following:

  • Improvements for base resin structure
    • Resin having structure that allows easier filler orientation
    • Addition of oriented polymer
  • Higher filler performance
    • Improved filler shape, and hybrid fillers
    • Highly thermal-conductive carbon fillers with insulating coatings
  • Filler dispersion
    • Reduced interfacial thermal resistance by filler surface treatment
    • Secured thermal conductive path by filler orientation
  • New materials
    • Graphene oxide based material, boron nitride nano-sheet material, etc.

 

Approaches not of interest

The following approaches are not of interest:

  • Approaches using injection molding
  • Approaches to add filler highly on thermoplastic resin alone

 

Preferred Collaboration types
Items to be submitted

Responses should use the Proposal Template which is linked to the “attachments“ shown at the bottom of this page and include the following items:

  • Category of technology
    • Material (base resin, filler, or other)
    • Dispersion technology (surface treatment, filler orientation, or other)
  • Overview of the proposed technology (advantages, principles)
  • Uniqueness of the technology
  • Development stage (performance verified at a lab level/prototype developed/implemented for practical use)
  • Current Performance
    • Material
      • Thermal conductivity
      • Withstand voltage performance (electrical resistivity)
      • Molding formability (thickness, flexibility)
    • Dispersion technology
      • Target materials
      • Improved physical properties
      • Application examples
  • Current challenges and future development plans
  • Past achievements (additional information indicating R&D capabilities, such as research papers and patents)
  • Organization overview

 

Area of Interest
Request Priority Normal Attachments Creation Date Document Title Author   April 2, 2017 REQ8339918-Response template_v2.doc Seh-Rin Sung Actions March 7, 2017 REQ8339918-Highly Thermal-Conductive and Insulating Material.pdf Seh-Rin Sung Actions

» Reference: REQ8339918

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This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [609203].

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