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Optical silicone binder extends thermal stability to >180°C for chip-scale LED packaging

Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP). The latest addition to the company's portfolio of advanced solutions for LED lighting, CL-1000 Binder offers best-in-class thermal stability and is optimized for compression molding processes. Available only in China, it leverages the same phenyl silicone chemistry as Dow Corning's other industry-leading high RI optical encapsulants. This can help optimize the efficiency of next-generation LED lighting designs without costly investments in more powerful LED dies.

"The growing adoption of chip-scale packaging is enabling lighting designs that pack increasing numbers of LED dies more densely together in smaller form factors," said Takuhiro Tsuchiya, global marketing manager at Dow Corning. "CL-1000 Optical Silicone Binder is Dow Corning's response to the rapidly rising temperatures within these emerging applications. A more thermally stable iteration of our high-RI optical materials, this new product is formulated specifically to help enhance the robustness of high-power CSP designs."

Validated through Dow Corning's testing, its thermal stability enables it to exhibit lower degradation and improved maintenance of mechanical properties vs. other high-RI silicone encapsulants after 2000 hours exposure to temperatures above 180°C. The new high-RI material also delivers excellent photo-stability with high clarity to further support reliable performance over the life of LED devices.

The CL-1000 Binder demonstrates good conformance with highly reflective Dow Corning WR-3001 and WR-3100 Die Edge Coat materials, enabling CSP packaging with enhanced reliability over longer periods. The product's high Shore D60 hardness also enables LED packaging to withstand dicing operations.

www.dowcorning.com

 

Subject Classifications

Industries and Applications | Electronics

Nonmetallic Engineering Materials | Electronic Materials

Nonmetallic Engineering Materials | Polymers and Plastics

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» Publication Date: 18/06/2017

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