TECHNOLOGICAL WATCH SERVICE
News
Powered by:

ITSC 2019 presentation: Solid-State Additive Manufacturing

Inovati, Santa Barbara, Calif., presented a discussion about the application of its impact consolidation Kinetic Metallization (KM) process to an advanced and superior 3D manufacturing technology.

When integrated with CAD/CAM, Inovati characterizes this new technology as Solid-State Additive Manufacturing (SSAM). This innovative spray deposition process provides unique opportunities for development of a 3D fabrication technique with material properties not currently feasible with conventional fusion-based AM processes.

 In particular, the low temperature attribute of the process enables fabrication of metallic and composite parts with metallurgically uniform properties, while fusion-based processes tend to be unstable or degrade at high melting temperatures. The SSAM deposition rates associated with Kinetic Metallization permit an order of magnitude faster fabrication rate of parts when compared to many conventional AM methods. The paper presented the developments of the technology to date and the potential applications.

Dr. Ralph Tapphorn , Mr. Howard Gabel , Mr. Travis Crowe , Inovati, Santa Barbara, California

www.inovati.com

Subject Classifications

Industries and Applications | Aerospace and Defense

Materials Processing and Treatment | Additive Manufacturing

Materials Processing and Treatment | Powder Metallurgy

Materials Processing and Treatment | Thermal Spray Technology

Email a friend

» Publication Date: 11/06/2019

» More Information

« Go to Technological Watch



AIMPLAS - Instituto Tecnológico del Plástico | C/ Gustave Eiffel, 4 (Valčncia Parc Tecnolňgic) | 46980 - PATERNA (Valencia) - SPAIN
(+34) 96 136 60 40
ecogelcronos@aimplas.es

This project has received funding from the European Union Seventh Framework Programme (FP7/2007-2013) under grant agreement n° [609203].

The sole responsibility for the content of this website lies with the authors. It does not necessarily reflect the opinion of the EC. The EC is not responsible for any use that may be made of the information contained therein.